Customized XRD 3003 I/W

For orientation of single crystal wafers and ingots.
World market leader for ultra-precise orientation systems for raw and grinded ingots and wafers. Full automatic XRD 3003 I/W orientation systems can be integrated in and adapted to customer's semiconductor production lines.

XRD 3003 Crystal Ingot/Wafer

Products Features

  • Setup of mechanical ingot rotation axis
  • Automatic ingot X-ray orientation to customer`s specified off-axis angle
  • Determination and marking of flat/ notch position
  • Control X-ray measurement of orientation and laser measurement of flat/ notch position for grinded ingot
  • Minimization of waste of material by 3D optical laser system
  • Special industrial software for system control, analysis, result documentation and data storage integrates all steps in customer's production line.

Solutions realized for

  • Si, SiC, GaAs, CaF2, SiO2,...
  • Orientations: 100, 110, 111, 511,...
    off-axis orientation <=15°
  • Ingot size <= 300 mm (12") diameter, <= 500mm length
  • Wafers <= 300 mm (12") diameter

Additional Information

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